CMP Pad Conditioner
Achieving a strong chemical bond at the molecular level between diamond abrasives and substrates! For use in CMP processes.
We propose a unique structure of pad conditioner covered with diamond for use in the CMP process by Morgan Advanced Ceramics. This structure features diamond abrasives coated on a silicon substrate or a ceramic substrate using CVD. We have achieved a strong chemical bond at the molecular level between the diamond abrasives and the substrate. It also has strong slurry resistance, with no chemical erosion from the slurry. Additionally, there is no loss or crushing of the diamond, and control over the density of the diamond abrasives is possible. For more details, please contact us.
- 企業：マツボー
- 価格：Other
